Upon numerous requests from authors, PIC 2026 submission deadline extended to September 30. Other key dates adjusted accordingly. Please submit your manuscripts on time. Thank you for your support.
Conference Background

PIC2026 · Shanghai

The 2026 International Conference on Progress in Informatics & Computing

December 18-20, 2026 | Shanghai, China

The 10th 2026 International Conference on Progress in Informatics and Computing (PIC2026) will take place in the beautiful city of Shanghai, China in December.

As the tenth edition of the PIC conference series, PIC2026 is a premier global conference advancing frontier research in informatics, computing, and artificial intelligence. Under the theme “Bridging Breakthroughs in AI, Informatics & Next-Generation Computing,” the conference highlights leading work on large language models, intelligent systems, data science, and next-generation computing. It will feature keynote speeches by world-renowned scholars, technical paper sessions, interactive workshops, and a vibrant poster session. We invite researchers and practitioners worldwide to join us for academic exchange, networking, and collaboration. PIC2026 will be organized by Shanghai University of Finance and Economics, China.

🎯 Conference Vision

The vision of PIC2026 is to advance the frontiers of informatics, Artificial Intelligence and next-generation computing, fostering interdisciplinary collaboration, showcasing breakthrough achievements, exchanging insights and cultivating scholars to translate research into meaningful real-world impact.

🏆 Previous Editions

The previuos PIC2024 (9th edition) attracted over 146 participants from 23+ countries, with an acceptance rate of 34%. PIC 2021 (8th edition) attracted 158 contributions from 25+ countirs, with an accetance rate of 58%. All the previous proceedings were published in IEEE Xplore, and indexed in EI Compendex and other major databases.

Notice: Important Deadline Extension

In response to numerous requests from authors, the organizing committee of PIC 2026 has decided to extend the paper submission deadline.

The new submission deadline is September 30. Accordingly, other key dates of the conference have been adjusted correspondingly.

Authors are encouraged to finalize and submit their manuscripts via the conference submission system before this updated deadline. Thank you for your continued interest and support for PIC 2026.

Call for Papers

📄 Topics of Interest

Including but not limited to: artificial intelligence, machine learning, knowledge engineering, computer vision, natural language processing, multimodal data science, large language models, multimodal large language models, LLM-based agent systems, human-computer interaction, software engineering, edge computing, information security, embodied intelligence, robotics, and AI-driven automation.

📚 Publication

Accepted papers will be published in the IEEE conference Proceedings.
Please refer to the official IEEE webpage for more information about PIC2026:
https://conferences.ieee.org/conferences_events/conferences/conferencedetails/72466 .
Extended versions of best papers will be invited for a special issue of several well-known journals.

Download CFP (PDF)

CMT Acknowledgment: The Microsoft CMT service was used for managing the peer-reviewing process for this conference. This service was provided for free by Microsoft and they bore all expenses, including costs for Azure cloud services as well as for software development and support.

Paper Submission

📄 Format & Template

All submitted papers must strictly follow the IEEE conference proceedings format (latest version). Templates are available for both LaTeX and Microsoft Word:

📏 Length & Language

Pages: 4–10 pages in IEEE conference format (including references, figures, and tables). The first 5 pages are included in the regular registration; each additional page (up to 10) will incur a charge of approximately USD 60, applicable only to the final camera‑ready version.

Note: Papers shorter than 4 full pages will be desk rejected without review.

Language: English.

🔒 Originality & Ethics

By submitting to PIC2026, authors confirm that:

  • The work is original, unpublished, and not under review elsewhere.
  • All authors have approved the submission.
  • The paper does not contain plagiarism or fabricated results.
  • Submissions must comply with IEEE Publication Ethics and Malpractice Statement.

📌 Submission Instructions (Step-by-Step)

  1. Prepare your manuscript in IEEE conference format (minimum 4 pages, English, original).
  2. Convert your manuscript to PDF (ensure all fonts are embedded).
  3. Visit the official submission system (Microsoft CMT).
  4. Create or log into your CMT account.
  5. Select “PIC2026” conference and choose the appropriate track (main conference).
  6. Enter paper title, abstract, keywords, and author information.
  7. Upload the PDF file and complete the submission.
  8. You will receive a confirmation email from CMT within 24 hours.
Submit Your Paper Now

⚖️ Double-Blind Review

PIC2026 follows a double-blind review process. Authors must:

  • Remove all author names, affiliations, and acknowledgments from the manuscript.
  • Remove any self-citations that would reveal the authors’ identity (e.g., “Our previous work [5]” → “Previous work [5]”).

📧 After Acceptance

If your paper is accepted, you will receive a notification email with instructions to:

  • Prepare the camera-ready version (including author names/affiliations).
  • Sign the IEEE copyright form.
  • Register for the conference before the deadline.
  • Present the work on-site or virtually (according to final program).

Important Dates

📅 Paper Submission Deadline August 31, 2026September 30, 2026
📢 Notification of Acceptance September 30, 2026October 30, 2026
✍️ Camera-ready & Registration Deadline October 20, 2026November 20, 2026
🎤 Conference Dates December 18 – 20, 2026

Committees

🏛️ General Chairs

Yinglin Wang, Shanghai University of Finance and Economics,China
Mengqi Zhou, IEEE Beijing Section, China

🏛️ Steering Committee Chairs

Hamido Fujita, Universiti Teknologi Malaysia, Malaysia
Yanghua Xiao, Fudan University, China
Enrique Herrera Viedma, University of Granada, Spain
Michael Sheng, Macquarie University, Australia
Jianjun Zhao, Kyushu University, Japan
Hongming Cai, Shanghai Jiaotong University, China
Liang Xiao, Nanjing University of Science and Technology, China

📚 Program Chairs

Xing Wu, Shanghai University, China
Zhichao Lian, Nanjing University of Science and Technology, China

🌐 Organization Chairs

Yun Chen, Shanghai University of Finance and Economics, China
Bo Huang, Shanghai University Of Engineering and Science, China

🌐 Track Chairs

Zheying Zhang, Tampere University, Finland
Nguyen Thanh Binh, Ho Chi Minh City University of Science, Vietnam
Xudong Mao, Sun Yat-sen University, China
Shuting He, Shanghai University of Finance and Economics, China
Qianmu Li, Nanjing University of Science and Technology, China
Lian Tao, Shanghai Business School, China
Rui Xiao, Shanghai University of Finance and Economics, China

📢 Regional Chairs

Victoria Lopez, Universidad Complutense de Madrid, Spain
Jyrki Nummenmaa, Tampere University, Finland
Nan Niu, University of North Florida, USA
Sasaki Jun, Yamato University, Japan
Zhaoxia Wang, Singapore Management University, Singapore
Byeungwoo Jeon, Sungkyunkwan University, South Korea
Hien D. Nguyen, University of Information Technology, Vietnam
Xin Xu, Wuhan University of Science and Technology, China
Philippe Fournier-Viger, Harbin Institute of Technology, Shenzhen, China
Yuanfang Li, Oracle Health and AI Australia, Australia


💻 Technical Program Committee

View Full Technical Program Committee (126 Members)
Akbar Sheikh Akbari, Leeds Beckett University, United Kingdom
Anri Morchiladze, International Black Sea University, Georgia
Arne Wiklund, University of Agder, Norway
Ayahiko Niimi, Future University Hakodate, Japan
Bal Krishna Subedi, Tribhuvan University, Nepal
Binh Nguyen, Vietnam National University Ho Chi Minh City, Vietnam
Bo Huang, Shanghai University of Engineering Science, China
Bo Zhao, Xi'an Jiaotong-Liverpool University, China
Cangqi Zhou, Nanjing University of Science and Technology, China
Canhui Wang, Huaqiao University, China
Cholwich Nattee, Thammasat University, Thailand
Christin Lindholm, Lund University, Sweden
Claudio Tomazzoli, University of Verona, Italy
Constantinos Constantinides, Concordia University, Canada
Cường Lê, Electric Power University, Vietnam
Damien Sambo, IMT Nord Europe, France
Daowen Qiu, Sun Yat-sen University, China
Daoye Zhu, Hohai University, China
Dongdong Zhao, Lanzhou University, China
Donghong Xu, China University of Mining and Technology, China
Du Nguyen, Nong Lam University, Vietnam
Emanuel Grant, University of North Dakota, United States
Farid Nouioua, Mohamed El Bachir El Ibrahimi University , Algeria
Fengchao Xiong, Nanjing University of Science and Technology, China
Guanlin He, Xihua University, China
Guoyuan Lin, China University of Mining and Technology, China
Hafiza Ayesha Chaudhry, University of Turin, Italy
Hai Nam Ha, The Electric Power University, Vietnam
Haodi Jiang, Sam Houston State University, United States
Haopeng Chen, Shanghai Jiao Tong University, China
Hiba Zuhair, Al-Nahrain University, Iraq
Hoang Tung, Electric Power University, Vietnam
Hongfeng Yu, University of Nebraska-Lincoln, United States
Hongming Cai, Shanghai Jiao Tong University, China
Huijie Chen, Beijing University of Technology, China
Iman Dehzangi, Rutgers University, United States
Izhar Oswaldo Escudero Ornelas, Xi'an Jiaotong-Liverpool University, China
Jia Wang, Xi'an Jiaotong-Liverpool University, China
Jianfeng Lu, Nanjing University of Science and Technology, China
Jianqiang Huang, Qinghai University, China
Jieming Ma, Xi'an Jiaotong-Liverpool University, China
Jin Sun, Nanjing University of Science and Technology, China
Jinan Xu, Beijing Jiaotong University, China
Jinfeng Wang, South China Agricultural University, China
Jinlei Jiang, Tsinghua University, China
Jorge Guerra Guerra, Universidad Nacional Mayor de San Marcos, Peru
Jyrki Nummenmaa, Tampere University, Finland
Kan Guo, Beihang University, China
Khawja Imran Masud, Dhaka University of Engineering and Technology, Bangladesh
Lei Huang, Ocean University of China, China
Lili Zhang, Hohai University, China
Liming Zhang, University of Macau, China
Linh Le Thi Trang, Electric Power University, Vietnam
Luo Fei, East China University of Science and Technology, China
M. Saqib Nawaz, Shenzhen University, China
Maxim Ryzhii, University of Aizu, Japan
Meihui Shi, Beijing University of Technology, China
Meng Xue, Shandong University, China
Mingxi Zhang, University of Shanghai for Science and Technology, China
Miroslav Velev, Aries Design Automation, LLC, United States
Mourad Nouioua, Mohamed El Bachir El Ibrahimi University, Algeria
Nawaraj Paudel, Tribhuvan University, Nepal
Nguyen Khanh, Electric Power University, Vietnam
Nguyen Phuc Hau, Electric Power University, Vietnam
Ning Cai, Beijing University of Posts and Telecommunications, China
Parameswari Krishnamurthy, IIIT Hyderabad, India
Peishun Liu, Ocean University of China, China
Pooja Vashisth, York University, Canada
Qiao Zhang, Shandong University, China
Qing Lei, Huaqiao University, China
Qingsong Guo, North University of China, China
Qiuxia LAI, Communication University of China, China
Quan Z. Sheng, Macquarie University, Australia
Ralf Doerner, Hochschule RheinMain, Germany
Ruijie Tian, Liaoning Normal University, China
Sabah Noor, Dhaka University of Engineering andTechnology, Bangladesh
Sabrina Senatore, University of Salerno, Italy
Shang Liu, China University of Mining and Technology, China
Shangce Gao, University of Toyama, Japan
Sheng Luo, Shenzhen University, China
Shridhar Devamane, MS Engineering College, India
Shuo Feng, Tsinghua University, China
Srikumar Krishnamoorthy, Indian Institute of Management Ahmedabad, India
Teng Ma, Xi'an Jiaotong-Liverpool University, China
Thang Huynh Quyet, Hanoi University of Science and Technology, Vietnam
Thangavel Murugan, United Arab Emirates University, United Arab Emirates
Thomas Selig, Xi'an Jiaotong-Liverpool University, China
Tiansong Li, Chongqing Normal University, China
Tianyong Hao, South China Normal University, China
Tien-Dao Luu, Can Tho University, Vietnam
Trung Tran, Electric Power University, Vietnam
Tu Nguyen, Electric Power University, Vietnam
Tuan-Dung Tran, University of Information Technology (VNU-HCM), Vietnam
Tung Nguyen, Electric Power University, Vietnam
WEN ZHOU, Anhui Normal University, China
Wenbo Dong, East China University of Science and Technology, China
Wenchao Jiang, Guangdong University of Technology, China
Xianghua Wang, Beijing University of Posts and Telecommunications, China
Xiangmin Han, Beijing University of Technology, China
Xiantong Luo, Beijing University of Technology, China
Xiaojun Zhou, Central South University, China
Xiaotong Cheng, Shandong University, China
Xinglong Zhang, National University of Defense Technology, China
Yan Pei, University of Aizu, Japan
Yang Zou, Hohai University, China
Yetong Cao, Shandong University, China
Yi Liang, Beijing University of Technology, China
Yingzi Gao, Shandong University, China
Yohei Nishidate, University of Aizu, Japan
Yu Liu, Xi'an Jiaotong-Liverpool University, China
Yuan Zhenyu, Northeastern University, China
Yuhong Feng, Shenzhen University, China
Yu-Jie Xiong, Shanghai University of Engineering Science, China
Yun Chen, Shanghai University of Finance and Economics, China
Yun Liu, Southwest University, China
yupeng liu, Harbin University of Science and Technology, China
Zaipeng Xie, Hohai University, China
Zhaokang Wang, Nanjing University of Aeronautics and Astronautics, China
Zhen Hua, Xi'an Jiaotong-Liverpool University, China
Zhihao Qu, Hohai University, China
Zhihua Xie, Jiangxi Science and Technology Normal University, China
Zhishang Wang, University of Aizu, Japan
Zhiting Yao, Hohai University, China
Zhiying Zhu, Hohai University, China
Zhongxing Yu, Shandong University, China
Zhuqing Jiang, Beijing University of Posts and Telecommunications, China

Program Highlights

Not available yet

※ Detailed program will be released in December 2026. Stay tuned for updates.

Registration

Not available yet

📆 Registration Rate

Regular Rate(Estimated): $480 USD
Student Rate(Estimated): $430 USD

✅ Registration fees include: access to all sessions, conference materials, coffee breaks, lunches, welcome reception, and digital proceedings.

Venue

📍 Conference Venue

🏨 Arula Plaza Shanghai
No. 188 Wudong Road, Yangpu District, Shanghai, China

The hotel is adjacent to the historic campus of Shanghai University of Finance and Economics in Yangpu District, just a five-minute drive from the prestigious Fudan University and Tongji University. It is also within walking distance of Metro Line 3 and Line 18 stations, offering convenient access to the bustling Wujiaochang Commercial Area.

🗺️ Travel Information

✈️ Shanghai Pudong International Airport: take Metro Line 2 (or the maglev high-speed train) → transfer to Line 18 to SUFE Station.

✈️🚄 Shanghai Hongqiao International Airport/ Hongqiao Railway Station: take Metro Line 10 → transfer to Line 18 to SUFE Station.

🚄 Shanghai Railway Station: take Metro Line 3 to Jiangwan Town Station, then walking to the Hotel.

Contact

📧 Conference Email

picconf@yeah.net

📞 Phone

+86-18140865935, Yitong Yang

📱 Social Media

QQ Group#: 921572090
Group Name: PIC2026

Secretariat: School of Computing and Artificial Intelligence, Shanghai University of Finance and Economics